The TRB10K21 series of onboard SPD products are specially designed to meet the stringent requirements that onboard miniaturized SPDs not ignite under extreme power frequency overload. This product also meets the latest requirements for TOV overload performance and other performance requirements in IEC61643:11-2011, GB18802.11-2016 and the third edition of UL1449; it meets the requirement of not igniting under power frequency overload 800V 100A.
The core technical advantage of TRB10K21 series on-board SPD products is the use of the company's top-level MOV chip with controllable melting point. The melting point of power frequency current is completely controlled in the center area of the chip, and the thermal detachment low-temperature solder point is designed on the copper sheet protruding in the middle. , A refractory piece of metal with a melting point is used under the protruding copper piece, which is difficult to be penetrated by the molten fluid in a short period of time. Smooth movement tripping is used to increase tripping distance, eliminate the possibility of arcing, improve reliability and save space. This structure is only applicable to the MOV produced by our company with a melting point within a radius of 0.5cm from the center. If the MOV penetration point is not in the central area, the effect will be significantly reduced.
This solution will be used for reliable miniaturized SPD (module thickness 12mm) design. According to this feature, the thermal detachment mechanism is optimized to make the heat conduction speed the fastest and the thermal detachment efficiency is excellent.